VeroTherm™ and VeroFlex™ Systems by YES. These systems will enable 3D stacking of memory and logic chips for high-performance AI accelerators, driven by large language model (LLM) applications.
Yield Engineering Systems (YES), a leading provider of process equipment for advanced packaging for AI and HPC systems, today announced that it has received multiple orders of VeroTherm™ and VeroFlex™ reflow systems from one of the largest memory suppliers. These systems will enable 3D stacking of memory and logic chips for high-performance AI accelerators, driven by large language model (LLM) applications.
The VeroTherm™ and VeroFlex™ reflow systems are designed to provide solutions for achieving sub-10μm micro-bump structures with fluxless solder and mass reflow processes in a low vacuum environment for wafers and panels respectively. These systems enable superior quality and total cost of ownership (CoO), particularly for the manufacturing of advanced packaging architectures such as stacked logic and high bandwidth memory (HBM) that are an integral part of AI accelerators.
According to Alex Chow, SVP of Sales and Business Development and Asia President at YES, “Our VeroTherm™ and VeroFlex™ product families offer vacuum processing with unique capabilities of removing oxides and reflowing solder into excellent bump shapes without defects found in older atmospheric pressure systems. These tools eliminate SnAg agglomerate defects and rough surfaces while minimizing inter-metallic compound zones, extending down to sub-10μm pitches.”
About YES
YES is a leading provider of differentiated technologies for materials and interface engineering. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via, and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.
출처: Yield Engineering Systems
언론연락처: Yield Engineering Systems Alex Chow
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